𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Finite element analysis of wire bonding non-stick issue in miniaturized package development

✍ Scribed by Li, Weiqiang; Chen, Haibin; Wu, Jingshen; Xue, Ke; Wong, Fei; Ng, Wai Keung; Li, Weiqiang; Cheng, Guangxu

Book ID: 121809281
Publisher: IEEE
Year: 2013
Weight: 844 KB
Category: Article
ISBN: 1479904988
DOI: 10.1109/ICEPT.2013.6756505

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2013 14th International Conference

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - A novel wafer level packaging for white light LED

✍ Xie, Ye; Chen, Dong; Zhang, Li; Tan, K H; Lai, C M 📂 Article 📅 2013 🏛 IEEE ⚖ 660 KB

[IEEE 2013 14th International Conference

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - The no-load vacuum eutectic solder die bonding process

✍ Linxiao, Jing; Xianrong, Chen; Xiaocheng, Feng; Jinchun, He 📂 Article 📅 2013 🏛 IEEE ⚖ 467 KB

[IEEE 2013 14th International Conference

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Combined thermal and hygro effects on the degradation of LED package

✍ Ma, Xiaosong; Zhang, G. Q. 📂 Article 📅 2013 🏛 IEEE ⚖ 298 KB

[IEEE 2013 14th International Conference

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Preparation of phosphor glass via screen printing technology and packaged performance for LEDs

✍ Yang, Liang; Chen, Mingxiang; Liu, Sheng; Zhou, Shenjun 📂 Article 📅 2013 🏛 IEEE ⚖ 971 KB

[IEEE 2013 14th International Conference

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Mechanical lock design for LED silicone lens with silicon substrate

✍ Yuan, Jiaojiao; Liu, Sheng; Lv, Zhicheng; Shi, Shuai; Lv, Yaping; Fang, Jing; Ji 📂 Article 📅 2013 🏛 IEEE ⚖ 448 KB

[IEEE 2013 14th International Conference

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Molecular dynamics simulation on thermal conductivity of single-walled carbon nanotubes

✍ Tang, Kai; Zhu, Fulong; Chen, Youkai; Li, Ying; Liao, Hengyou; Liu, Sheng 📂 Article 📅 2013 🏛 IEEE ⚖ 328 KB