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[IEEE 2012 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2012.02.19-2012.02.23)] 2012 IEEE International Solid-State Circuits Conference - 3D-MAPS: 3D Massively parallel processor with stacked memory

✍ Scribed by Kim, Dae Hyun; Athikulwongse, Krit; Healy, Michael; Hossain, Mohammad; Jung, Moongon; Khorosh, Ilya; Kumar, Gokul; Lee, Young-Joon; Lewis, Dean; Lin, Tzu-Wei; Liu, Chang; Panth, Shreepad; Pathak, Mohit; Ren, Minzhen; Shen, Guanhao; Song, Taigon; Woo, Dong Hyuk; Zhao, Xin; Kim, Joungho; Choi, Ho; Loh, Gabriel; Lee, Hsien-Hsin; Lim, Sung Kyu

Book ID: 111877001
Publisher: IEEE
Year: 2012
Weight: 267 KB
Volume: 0
Category: Article
ISBN: 1467303755
DOI: 10.1109/isscc.2012.6176969

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