[IEEE 2012 e-Manufacturing & Design Collaboration Symposium (eMDC) - HsinChu, Taiwan (2012.09.4-2012.09.4)] 2012 e-Manufacturing & Design Collaboration Symposium (eMDC) - Micro bridge technology, a better solution for 3D-IC interconnection

✍ Scribed by Cheng, Karl

• Book ID: 118130931
• Publisher: IEEE
• Year: 2012
• Weight: 64 KB
• Category: Article
• ISBN: 1467345415
• DOI: 10.1109/emdc.2012.6338438