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[IEEE 2012 25th International Conference on VLSI Design. VLSI Design 2012. Held jointly with 11th International Conference on Embedded Systems - Hyderabad (2012.01.7-2012.01.11)] 2012 25th International Conference on VLSI Design - Tutorial T7A: New Modeling Methodologies for Thermal Analysis of 3D ICs and Advanced Cooling Technologies of the Future

✍ Scribed by Atienza, D.; Shridhar, A.

Book ID: 115525771
Publisher: IEEE
Year: 2012
Weight: 226 KB
Category: Article
ISBN: 0769546382
DOI: 10.1109/vlsid.2012.34

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