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[IEEE 2011 IEEE Cool Chips XIV - Yokohama, Japan (2011.04.20-2011.04.22)] 2011 IEEE Cool Chips XIV - COOL interconnect low power interconnection technology for scalable 3D LSI design

✍ Scribed by Chacin, Marco; Uchida, Hiroyuki; Hagimoto, Michiya; Miyazaki, Takashi; Ohkawa, Takeshi; Ikeno, Rimon; Matsumoto, Yukoh; Imura, Fumito; Suzuki, Motohiro; Kikuchi, Katsuya; Nakagawa, Hiroshi; Aoyagi, Masahiro

Book ID: 120006426
Publisher: IEEE
Year: 2011
Weight: 528 KB
Category: Article
ISBN: 1612848834
DOI: 10.1109/COOLCHIPS.2011.5890921

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