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[IEEE 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Naples, Italy (2011.05.8-2011.05.11)] 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - An analytical model of the RF impedance change due to solder joint cracking

✍ Scribed by Azarian, Michael H.; Lando, Emile; Pecht, Michael

Book ID: 126714733
Publisher: IEEE
Year: 2011
Weight: 341 KB
Category: Article
ISBN: 1457704668
DOI: 10.1109/SPI.2011.5898847

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