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[IEEE 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Naples, Italy (2011.05.8-2011.05.11)] 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology

✍ Scribed by Fourneaud, L.; Lacrevaz, T.; Charbonnier, J.; Fuchs, C.; Farcy, A.; Bermond, C.; Eid, E.; Roullard, J.; Flechet, B.

Book ID: 120632620
Publisher: IEEE
Year: 2011
Weight: 428 KB
Category: Article
ISBN: 1457704668
DOI: 10.1109/SPI.2011.5898841

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