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[IEEE 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Naples, Italy (2011.05.8-2011.05.11)] 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - 3D interconnection using butterfly via for high speed and RF package design

✍ Scribed by Lee, SeungJae; Yu, JiHeon; Kim, GaWon; Kim, JinYoung

Book ID: 120006519
Publisher: IEEE
Year: 2011
Weight: 312 KB
Category: Article
ISBN: 1457704668
DOI: 10.1109/SPI.2011.5898843

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