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[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Modeling of heat dissipation in SMD chip components

✍ Scribed by Bunea, Radu; Svasta, Paul; Codreanu, Norocel-Dragos

Book ID: 115500772
Publisher: IEEE
Year: 2011
Weight: 580 KB
Volume: 0
Category: Article
ISBN: 1457721112
DOI: 10.1109/isse.2011.6053893

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