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[IEEE 2010 International Conference on Electronics and Information Engineering (ICEIE 2010) - Kyoto, Japan (2010.08.1-2010.08.3)] 2010 International Conference on Electronics and Information Engineering - A study of Through Silicon Via impact to 3D Network-on-Chip design

✍ Scribed by Xu, Thomas Canhao; Liljeberg, Pasi; Tenhunen, Hannu

Book ID: 115525619
Publisher: IEEE
Year: 2010
Weight: 933 KB
Volume: 0
Category: Article
ISBN: 1424476798
DOI: 10.1109/iceie.2010.5559865

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