[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Design and modeling for chip-to-chip communication at 20 Gbps

✍ Scribed by Jianmin Zhang, ; Chen, Q B; Qiu, K; Scogna, A C; Schauer, M; Romo, G; Drewniak, J L; Orlandi, A

• Book ID: 115492870
• Publisher: IEEE
• Year: 2010
• Weight: 750 KB
• Volume: 0
• Category: Article
• ISBN: 142446305X
• DOI: 10.1109/isemc.2010.5711320