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[IEEE 2010 IEEE Custom Integrated Circuits Conference -CICC 2010 - San Jose, CA, USA (2010.09.19-2010.09.22)] IEEE Custom Integrated Circuits Conference 2010 - Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions

✍ Scribed by Van der Plas, Geert; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Limaye, Paresh; Mercha, Abdelkarim; Stucchi, Michele; Oprins, Herman; Vandevelde, Bart; Minas, Nikolas; Cupac, Miro; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Beyne, Eric; Marchal, Paul

Book ID: 115527693
Publisher: IEEE
Year: 2010
Weight: 877 KB
Volume: 0
Category: Article
ISBN: 1424457580
DOI: 10.1109/cicc.2010.5617425

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