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[IEEE 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) - Wanchai, Hong Kong, China (2010.01.24-2010.01.28)] 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) - Hybrid fabrication of microfluidic chips based on COC, silicon and TMMF dry resist

✍ Scribed by Kalkandjiev, Kiril; Zengerle, Roland; Koltay, Peter

Book ID: 121325116
Publisher: IEEE
Year: 2010
Weight: 767 KB
Category: Article
ISBN: 1424457610
DOI: 10.1109/MEMSYS.2010.5442480

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