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[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Advanced investigations on PCB traces fusing in high power applications

✍ Scribed by Codreanu, Norocel D.; Bunea, Radu; Svasta, Paul

Book ID: 115500823
Publisher: IEEE
Year: 2010
Weight: 221 KB
Volume: 0
Category: Article
ISBN: 1424481236
DOI: 10.1109/siitme.2010.5652937

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