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[IEEE 2010 IEEE 13th International Conference on Computational Science and Engineering (CSE) - China, TBD, Hong Kong (2010.12.11-2010.12.13)] 2010 13th IEEE International Conference on Computational Science and Engineering - Minimizing Thermal Disparities during Placement in 3D ICs

✍ Scribed by Ghosal, Prasun; Rahaman, Hafizur; Dasgupta, Parthasarathi

Book ID: 125453604
Publisher: IEEE
Year: 2010
Weight: 405 KB
Category: Article
ISBN: 1424495911
DOI: 10.1109/cse.2010.28

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