✦ LIBER ✦
[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - A study on fine pitch Au and Cu WB integrity vs. Ni thickness of Ni/Pd/Au bond pad on C90 low k wafer technology for high temperature automotive
✍ Scribed by Eu Poh Leng, ; Poh Zi Song, ; Au Yin Kheng, ; Yong, C.C.; Tran Tu, Anh; Arthur, John; Downey, Harold; Mathew, Varughese; Chee Yit Yin,
- Book ID
- 126662950
- Publisher
- IEEE
- Year
- 2010
- Weight
- 928 KB
- Category
- Article
- ISBN
- 1424488257
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