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[IEEE 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Shanghai, China (2010.11.1-2010.11.4)] 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology - Multiple Ti/Al stacks induced thermal stability enhancement in Ti/Al/Ni/Au Ohmic contact on AlGaN/GaN heterostructure

✍ Scribed by Dong, Zhihua; Wang, Jinyan; Gong, Rumin; Liu, Shenghou; Wen, C. P.; Yu, Min; Xu, Fujun; Hao, Yilong; Shen, Bo; Wang, Yangyuan

Book ID: 121871799
Publisher: IEEE
Year: 2010
Weight: 500 KB
Category: Article
ISBN: 1424457971
DOI: 10.1109/ICSICT.2010.5667648

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