✦ LIBER ✦

[IEEE 2009 IEEE Energy Conversion Congress and Exposition. ECCE 2009 - San Jose, CA (2009.09.20-2009.09.24)] 2009 IEEE Energy Conversion Congress and Exposition - 3-D thermal simulation of power module packaging

✍ Scribed by Swan, I.R.; Bryant, A.T.; Parker-Allotey, N.-A.; Mawby, P.A.

No coin nor oath required. For personal study only.

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