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[IEEE 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Virginia Beach, VA, USA (2009.10.18-2009.10.21)] 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena - Dielectric and thermal properties of Polyamide-imide (PAI) films

✍ Scribed by Diaham, S.; Locatelli, M. L.; Lebey, T.; Dinculescu, S.

Book ID: 120177716
Publisher: IEEE
Year: 2009
Weight: 190 KB
Category: Article
ISBN: 1424445574
DOI: 10.1109/CEIDP.2009.5377778

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