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[IEEE 2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE) - Beijing, China (2009.10.27-2009.10.29)] 2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications - Substrate integrated cylindrical cavity

✍ Scribed by Luan, Xiu-zhen; Tan, Ke-jun

Book ID: 125508864
Publisher: IEEE
Year: 2009
Weight: 155 KB
Category: Article
ISBN: 1424440769
DOI: 10.1109/MAPE.2009.5355826

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