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[IEEE 2009 17th IFIP International Conference on Very Large Scale Integration (VLSI-SoC) - Florianopolis, Brazil (2009.10.12-2009.10.14)] 2009 17th IFIP International Conference on Very Large Scale Integration (VLSI-SoC) - A multistep extrapolated S-parameter model for arbitrary on-chip interconnect structures

✍ Scribed by Bacinschi, Petru B.; Glesner, Manfred

Book ID: 126750920
Publisher: IEEE
Year: 2009
Weight: 237 KB
Category: Article
ISBN: 1457702371
DOI: 10.1109/VLSISOC.2009.6041341

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