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[IEEE 2008 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) - San Jose, CA, USA (2008.11.10-2008.11.13)] 2008 IEEE/ACM International Conference on Computer-Aided Design - Thermal-aware reliability analysis for Platform FPGAs

✍ Scribed by Mangalagiri, Prasanth; Bae, Sungmin; Krishnan, Ramakrishnan; Yuan Xie, ; Narayanan, Vijaykrishnan

Book ID: 120814369
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 421 KB
Category: Article
ISBN: 142442819X
DOI: 10.1109/ICCAD.2008.4681656

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