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[IEEE 2008 IEEE Region 10 and the Third international Conference on Industrial and Information Systems (ICIIS) - Kharagpur, India (2008.12.8-2008.12.10)] 2008 IEEE Region 10 and the Third international Conference on Industrial and Information Systems - Analysis of Folded H-Plane Tee Junction Using Multiple Cavity Modeling Technique

✍ Scribed by Panda, Debendra Kumar; Chakraborty, Ajay

Book ID: 120263270
Publisher: IEEE
Year: 2008
Weight: 263 KB
Category: Article
DOI: 10.1109/ICIINFS.2008.4798379

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