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[IEEE 2008 IEEE International Conference on Mechatronics and Automation (ICMA) (Formerly ICIMA) - Takamatsu, Japan (2008.08.5-2008.08.8)] 2008 IEEE International Conference on Mechatronics and Automation - Design methodology of high frequency ultrasonic transducer for wire bonding

✍ Scribed by Zhao, Xingyu; Wang, Fujun; Zhang, Dawei

Book ID: 120882270
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 431 KB
Category: Article
ISBN: 1424426316
DOI: 10.1109/ICMA.2008.4798895

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