[IEEE 2007 International Microsystems, P
โฆ LIBER โฆ
[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Impact of low-K wire bond stacked flip chip CSP package material on reliability test
โ Scribed by Tsung-shu Lin, ; Chen-hsiao Wang, ; Lin, Joe; Chen, K. M.
- Book ID
- 126624080
- Publisher
- IEEE
- Year
- 2007
- Weight
- 943 KB
- Category
- Article
- ISBN
- 1424416361
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