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[IEEE 2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application - Cairo, Egypt (2007.01.3-2007.01.6)] 2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application - Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

✍ Scribed by Nakayama, Wataru

Book ID: 126718713
Publisher: IEEE
Year: 2007
Weight: 305 KB
Category: Article
ISBN-13: 9781424408979
DOI: 10.1109/THETA.2007.363407

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