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[IEEE 2007 14th International Conference on Mixed Design of Integrated Circuits and Systems - Ciechocinek, Poland (2007.06.21-2007.06.23)] 2007 14th International Conference on Mixed Design of Integrated Circuits and Systems - Application of Advanced Thermal Analysis Method for Investigation of Internal Package Structure

✍ Scribed by Banaszczyk, J.; Janicki, M.; Vermeersch, B.; De Mey, G.; Napieralski, A.

Book ID: 121744196
Publisher: IEEE
Year: 2007
Weight: 217 KB
Category: Article
ISBN-13: 9788392263296
DOI: 10.1109/MIXDES.2007.4286224

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