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[IEEE 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Budapest, Hungary (2007.09.17-2007.09.19)] 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Copper-filled macroporous Si for microchannel heat sink tecnology

✍ Scribed by Zacharatos, Filimon; Nassiopoulou, Androula

Book ID: 126751664
Publisher: IEEE
Year: 2007
Weight: 843 KB
Category: Article
ISBN: 2355000026
DOI: 10.1109/THERMINIC.2007.4451747

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