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[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Crosstalk and delay time analysis of high density interconnects on LTCC substrate

✍ Scribed by Orlandi, A.; Antonini, G.; Moca, C.; Scogna, A.C.

Book ID: 120610731
Publisher: IEEE
Year: 2006
Weight: 585 KB
Category: Article
ISBN-13: 9781424402939
DOI: 10.1109/ISEMC.2006.1706397

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