[IEEE 2005 International Conference on Asian Green Electronics - Shanghai, China (15-18 March 2005)] Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. - Effects of Bi - Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy

✍ Scribed by Xie, H.P.; Yu, D.Q.; Wang, L.

• Book ID: 121699338
• Publisher: IEEE
• Year: 2005
• Weight: 857 KB
• Category: Article
• ISBN-13: 9780780388062
• DOI: 10.1109/agec.2005.1452324