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[IEEE 2005 IEEE International Conference on Mechatronics - Taipei, Taiwan (10-12 July 2005)] IEEE International Conference on Mechatronics, 2005. ICM '05. - Rapid mold surface heating/cooling using electromagnetic induction technology

✍ Scribed by Chen, S.C.; Peng, H.S.; Chang, J.A.; Jong, W.R.

Book ID: 125520509
Publisher: IEEE
Year: 2005
Tongue: English
Weight: 688 KB
Category: Article
ISBN-13: 9780780389984
DOI: 10.1109/ICMECH.2005.1529359

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