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[IEEE 2004 International IEEE Conference on the Asian Green Electronics (AGEC) - Hong Kong, China & Shenzhen, China (5-6 Jan. 2004 & 7-9 Jan. 2004)] Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC) - Reliability of ACF joint using bumpless chip after reflow process

✍ Scribed by Chiang, W.K.; Chan, Y.C.

Book ID: 126637433
Publisher: IEEE
Year: 2004
Weight: 297 KB
Category: Article
ISBN-13: 9780780382039
DOI: 10.1109/AGEC.2004.1290911

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