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[IEEE 2003 Electrical Insulation Conference/Electrical Manufacturing and Coil Winding Expo - Indianapolis, Indiana, USA (23-25 Sept. 2003)] Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Technology Conference (Cat. No.03CH37480) - Epoxy, Urethane, Silicone; choice of encapsulant for high reliability magnetic components

✍ Scribed by Arris, H.W.; Trujillo, M.O.; Sanchez, R.O.

Book ID: 111685479
Publisher: IEEE
Year: 2003
Weight: 314 KB
Volume: 0
Category: Article
ISBN-13: 9780780379350
DOI: 10.1109/eicemc.2003.1247888

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