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[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Effect of simulation methodology on solder joint crack growth correlation

✍ Scribed by Darveaux, R.

Book ID: 121842816
Publisher: IEEE
Year: 2000
Weight: 952 KB
Edition: 2000
Category: Article
ISBN-13: 9780780359086
DOI: 10.1109/ECTC.2000.853299

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