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[IEEE 19th International Symposium on Discharge and Electrical Insulation in Vacuum - Xi'an, China (18-22 Sept. 2000)] Proceedings ISDEIV. 19th International Symposium on Discharges and Electrical Insulation in Vacuum (Cat. No.00CH37041) - The distribution of the temperature pattern and stress field on metallic details under the effect of electron, ion and plasma fluxes

✍ Scribed by Kostyuk, G.I.; Vollak, E.

Book ID: 126685702
Publisher: IEEE
Year: 2000
Tongue: English
Weight: 192 KB
Volume: 2
Category: Article
ISBN-13: 9780780357914
DOI: 10.1109/DEIV.2000.879080

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