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[IEEE 1999 IEEE Radio Frequency Integrated Circuits Symposium - Anaheim, CA, USA (13-15 June 1999)] 1999 IEEE Radio Frequency Integrated Circuits Symposium (Cat No.99CH37001) - Ceramic technology for integrated packaging for wireless

✍ Scribed by Amey, D.; Barnwell, P.; Brown, R.; Gaughan, F.; Horowitz, S.; London, A.; Novak, R.; Slutz, D.; Wilcox, D.

Book ID: 120980515
Publisher: IEEE
Year: 1999
Weight: 456 KB
Edition: 1999
Category: Article
ISBN-13: 9780780356047
DOI: 10.1109/RFIC.1999.805240

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