[IEEE 1997 International Conference on Multichip Modules - Denver, CO, USA (2-4 April 1997)] Proceedings 1997 International Conference on Multichip Modules - Embedded passive functions for RF and mixed-signal circuits

[IEEE 1997 International Conference on M

[IEEE 1997 International Conference on Multichip Modules - Denver, CO, USA (2-4 April 1997)] Proceedings 1997 International Conference on Multichip Modules - Integration of passive components for microwave filters in MCM-D

✍ Pieters, P.; Brebels, S.; Beyne, E. 📂 Article 📅 1997 🏛 IEEE ⚖ 734 KB

[IEEE 1997 International Conference on M

[IEEE 1997 International Conference on Multichip Modules - Denver, CO, USA (2-4 April 1997)] Proceedings 1997 International Conference on Multichip Modules - Thermosonic gold ball bonding to alternate plating finishes on laminate MCM substrates

✍ Dunn, C.; Johnson, R.W.; Bozack, M.; Kromis, C.; Harris, J.; Knadler, M. 📂 Article 📅 1997 🏛 IEEE ⚖ 717 KB

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Multichip-modules (MCMs) for micro- and millimeter-wave applications-a challenge?

✍ Oppermann, M. 📂 Article 📅 1998 🏛 IEEE ⚖ 665 KB

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Thin film passive elements on polyimide film

✍ Saia, R.J.; Cole, H.S.; Durocher, K.M.; Nielsen, M.C. 📂 Article 📅 1998 🏛 IEEE ⚖ 506 KB

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Study of RF flip-chip assembly with underfill epoxy

✍ Zhang, W.; Su, B.; Feng, Z.; Gupta, K.C.; Lee, Y.C. 📂 Article 📅 1998 🏛 IEEE 🌐 English ⚖ 540 KB

now In Its Seventh Year, Mcm Has Expanded To Reflect The Evolution And Applications Since 1992. The Mcms Most Commonly Envisioned In 1992 Interconnected 60 To 100 Chips On A Thin Film Substrate.

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - High frequency IC to IC signaling on rapidly prototyped flip chip MCM-D substrate

✍ Reed, J.D.; Caldwell, G.; Wang, M.; Hirsch, T.; Yee, I.; Lunceford, B.; Somadder 📂 Article 📅 1998 🏛 IEEE 🌐 English ⚖ 942 KB

now In Its Seventh Year, Mcm Has Expanded To Reflect The Evolution And Applications Since 1992. The Mcms Most Commonly Envisioned In 1992 Interconnected 60 To 100 Chips On A Thin Film Substrate.