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[IEEE 1997 IEEE MTT-S International Microwave Symposium Digest - Denver, CO, USA (8-13 June 1997)] 1997 IEEE MTT-S International Microwave Symposium Digest - Surface mount microwave package characterization technique

✍ Scribed by Pham, A.; Chun, C.; Laskar, J.; Hutchison, B.

Book ID: 121197258
Publisher: IEEE
Year: 1997
Weight: 336 KB
Volume: 2
Category: Article
ISBN-13: 9780780338142
DOI: 10.1109/MWSYM.1997.602969

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