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[IEEE 1996 IEEE International Symposium on Electronics and the Environment. ISEE-1996 - Dallas, TX, USA (6-8 May 1996)] Proceedings of the 1996 IEEE International Symposium on Electronics and the Environment. ISEE-1996 - A framework for analyzing energy efficient injection-molding die design

✍ Scribed by Mattis, J.; Sheng, P.; DiScipio, W.; Leong, K.

Book ID: 124152222
Publisher: IEEE
Year: 1996
Tongue: English
Weight: 650 KB
Category: Article
ISBN-13: 9780780329508
DOI: 10.1109/ISEE.1996.501879

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