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[IEEE 1995 Proceedings. 45th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 1995)] 1995 Proceedings. 45th Electronic Components and Technology Conference - Reliability and moisture sensitivity evaluation of 225-pin, 2 layered overmolded (OMPAC) ball grid array package

✍ Scribed by Poborets, B.; Ilyas, Q.S.M.; Potter, M.; Argyle, J.

Book ID: 126701837
Publisher: IEEE
Year: 1995
Weight: 448 KB
Category: Article
ISBN-13: 9780780327368
DOI: 10.1109/ECTC.1995.515318

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