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[IEEE 1995 IEEE MTT-S International Microwave Symposium - Orlando, FL, USA (16-20 May 1995)] Proceedings of 1995 IEEE MTT-S International Microwave Symposium - High density microwave packaging for T/R modules

✍ Scribed by Wooldridge, J.

Book ID: 121740503
Publisher: IEEE
Year: 1995
Weight: 289 KB
Category: Article
ISBN-13: 9780780325814
DOI: 10.1109/MWSYM.1995.406070

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