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[IEEE 1992 42nd Electronic Components & Technology Conference - San Diego, CA, USA (18-20 May 1992)] 1992 Proceedings 42nd Electronic Components & Technology Conference - Guidelines for thermal management of multichip modules

✍ Scribed by Liang, L.; Hamzehdoost, A.

Book ID: 126729710
Publisher: IEEE
Year: 1992
Weight: 404 KB
Category: Article
ISBN-13: 9780780301672
DOI: 10.1109/ECTC.1992.204295

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