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[IEEE 1991 41st Electronic Components & Technology Conference - Atlanta, GA, USA (11-16 May 1991)] 1991 Proceedings 41st Electronic Components & Technology Conference - Fatigue analysis of flip chip assemblies using thermal stress simulations and a Coffin-Manson relation

✍ Scribed by Darveaux, R.; Banerji, K.

Book ID: 121664061
Publisher: IEEE
Year: 1991
Weight: 707 KB
Category: Article
ISBN-13: 9780780300125
DOI: 10.1109/ECTC.1991.163971

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