✦ LIBER ✦

[IEEE 1991 41st Electronic Components & Technology Conference - Atlanta, GA, USA (11-16 May 1991)] 1991 Proceedings 41st Electronic Components & Technology Conference - A new packaging technology for high-speed photoreceivers using micro-solder bumps

✍ Scribed by Tsunetsugu, H.; Katsura, K.; Hayashi, T.; Ishitsuka, F.; Hata, S.; Takachio, N.

No coin nor oath required. For personal study only.

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