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[IEEE 17th International Zurich Symposium on Electromagnetic Compatibility - Singapore (2006.02.27-2006.03.3)] 2006 17th International Zurich Symposium on Electromagnetic Compatibility - Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages

✍ Scribed by Weiliang Yuan, ; Kuah Hsian Pang, ; Wang Chuen Khiang, ; Desmond Chong Yok Rue, ; Daengdora, M.A.

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