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[IEEE 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium - La Jolla, CA, USA (12-14 Sept. 1994)] Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium - The improvement of PBGA solder ball strength under high temperature storage

✍ Scribed by Miyazaki, T.; Terashima, K.

Book ID: 126605083
Publisher: IEEE
Year: 1994
Weight: 620 KB
Edition: 16
Category: Article
ISBN-13: 9780780320376
DOI: 10.1109/IEMT.1994.404727

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