Identification of intermetallic compounds in electrodeposited copper-cadmium alloys by electrochemical techniques
✍ Scribed by V.D. Jović; A.R. Despić; J.S. Stevanović; S. Spaić
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 900 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0013-4686
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✦ Synopsis
Anodic sweep voltammetry was used'to identify different intermetallic compounds and assess their amount in copper-cadmium alloys. Four compounds are found in thin (1-8 pm) electroplated alloy films: CuCd,, Cu,Cd,, Cu,Cd, and Cu,Cd. Their presence is reflected in four peaks recorded in the voltammograms, the fifth peak corresponding to dissolution of copper remaining after dissolution of cadmium. For quantitative assessment potential-step technique was also used, avoiding the problem of overlap of peaks. Indications were obtained that the first peak is a mixture of pure cadmium and the cadmium rich compound. Since changes in voltammograms with time of resting of the alloy in an inert atmosphere were found, they were ascribed to solid state reactions of formation of compounds richer in copper from the one richer in cadmium (or pure cadmium) and pure copper. Thermodynamics of alloy formation was considered and approximate values of the standard potentials and standard free energies of the compounds are evaluated.