IC thermal simulation and modeling via efficient multigrid-based approaches

✍ Scribed by Peng Li; Pileggi, L.T.; Asheghi, M.; Chandra, R.

• Book ID: 117907567
• Publisher: IEEE
• Year: 2006
• Tongue: English
• Weight: 947 KB
• Volume: 25
• Category: Article
• ISSN: 0278-0070
• DOI: 10.1109/tcad.2005.858276