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IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density

✍ Scribed by Clark, B.; Hill, Y.

Book ID: 117911285
Publisher: IEEE
Year: 1980
Tongue: English
Weight: 597 KB
Volume: 3
Category: Article
ISSN: 0148-6411
DOI: 10.1109/tchmt.1980.1135570

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