A coupled heat transfer and thermal stress analysis is developed for a thin-film high-T c superconductor device. The thermal boundary resistance between the film and substrate, which is modelled as a function of interfacial peeling stress, is used to couple the structural and thermal sides of the mo
Hyperbolic heat conduction in thin-film high Tc superconductors with interface thermal resistance
โ Scribed by Whey-Bin Lor; Hsin-Sen Chu
- Publisher
- Elsevier Science
- Year
- 1999
- Tongue
- English
- Weight
- 361 KB
- Volume
- 39
- Category
- Article
- ISSN
- 0011-2275
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โฆ Synopsis
This article numerically analyzes the hyperbolic heat conduction problem in the ยฎlm and substrate composites under an imposed surface heat ยฏux on the exterior ยฎlm surface. The radiation heat ยฏux model is employed to take account of the interface thermal resistance. The reยฏection and transmission occur at the contact surface of the dissimilar material which depends on the substrate properties and interface conditions. The interface resistance restricts the energy transmission across the interface and alerts the reยฏected and transmitted waves' strength. Neglecting the interface thermal resistance causes the temperature distribution in the ยฎlm to be greatly underestimated. Moreover, the hyperbolic equation predicts signiยฎcantly dierent results with those predicted by the parabolic equation at small time scales. The discrepancies between the solutions in an investigation of superconductor YยฑBaยฑCuยฑO ยฎlm depositions on several commonly used substrates are examined.
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